SCM-DQ673A
SCM-D (Seavo Compute Module) 核心模块
可选Q670/H610芯片, 支持12代/13代Core, Pentium, Celeron处理器
支持DDR4内存, 提供2*Intel千兆网卡
通过B2B连接器提供丰富的I/O与显示资源
载板可快速定制, 灵活选配SCM模块
146*105mm
General
CPU

Intel® 12th/13th Generation Core™ i3/i5/i7/i9, Pentium®, Celeron® CPU, LGA1700

Max TDP 125W, 8+4 cores
Chipset
 		Intel® Q670/H610, TDP 6W
Memory
 		DDR4-3200, 2*SO-DIMM, up to 64 GB
BIOS
 		AMI UEFI BIOS
System
 		Windows 10/11, Linux
I/O
Ethernet
 		2*Intel® GbE Controller
Audio
 		1*Realtek® ALC897 5.1 channel HDA Codec
High Speed Signal

When Chipset is Q670:

4*USB 3.0, 4*SATA 3.0, 1*PCIe x16, 1*PCIe x4, 4*PCIe

When Chipset is H610:

4*USB 3.0, 4*SATA 3.0, 1*PCIe x16, 1*PCIe x2, 4*PCIe

USB 2.0
 		8*USB 2.0
Serial
 		6*TTL
GPIO
 		4*programmable GPIO
Feature Interface

1*LPC, 1*SM BUS, 1*I2C, 1*SPI, 2*USB OC,

1*FAN Control, 1*Power Control, Power OK
Display
Display Interface

1*eDP, 1*VGA, 2*DDI

DDI can be set to DP/HDMI/DVI
Multiple Display
 		Q670-Quad, H610-Triple 
Mechanical & Environment   
Dimension
 		146*105mm
Power Input
 		DC 12V, 5V
Temperature Operation: 0℃~60℃, Storage: -25℃~75℃
Relative Humidity
 		Operation: 10%~90%, non-condensing