Seavo Technology

SCM-D CPU Module, Intel 12^th/13^th Gen Core i3/i5/i7 CPU with Q670/H610, DDR4 Memory, 2*Intel GbE

SCM-D (Seavo Compute Module based on Desktop platform)

Supports Intel 12^th/13^th Gen Core, Pentium, Celeron CPU with Q670/H610 Chipset

Supports Q670/H610 Chipset

Supports DDR4 Memory, provides 2*Intel GbE

Provides rich resources of I/O and Displays through B2B connectors

Fast to develop Carrier Board, flexible to select SCM CPU Module

146*105mm

Driver Downloads

Specification

General
CPU	Intel^® 12^th/13^th Generation Core^™ i3/i5/i7/i9, Pentium^®, Celeron^® CPU, LGA1700 Max TDP 128W, 8+4 cores
Chipset	Intel^® Q670/H610, TDP 6W
Memory	DDR4-3200, 2*SO-DIMM, up to 64 GB
BIOS	AMI UEFI BIOS
System	Windows 10/11, Linux
I/O
Ethernet	2*Intel^® GbE Controller
Audio	1*Realtek^® ALC897 5.1 channel HDA Codec
High Speed Signal	When Chipset is Q670: 4USB 3.0, 4SATA 3.0, 1PCIe x16, 1PCIe x4, 4PCIe When Chipset is H610: 4USB 3.0, 4SATA 3.0, 1PCIe x16, 1PCIe x2, 4PCIe
USB 2.0	8*USB 2.0
Serial	6*TTL
GPIO	4*programmable GPIO
Feature Interface	1LPC, 1SM BUS, 1I2C, 1SPI, 2USB OC, 1FAN Control, 1*Power Control, Power OK
Display
Display Interface	1eDP, 1VGA, 2*DDI DDI can be set to DP/HDMI/DVI
Multiple Display	Q670-Quad, H610-Triple
Mechanical & Environment
Dimension	146*105mm
Power Input	DC 12V, 5V
Temperature	Operation: 0℃~60℃, Storage: -25℃~75℃
Relative Humidity	5%~95%, non-condensing

Variants

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